Procedure:

Single-face panel process:
Material sending => Drilling => Removing burr =>Roundness transfer => Plating => Eroding board => Removing film => Etch check => Blocking soldering=> Character => Computer mill/mould rushing =>Short circuit test => Final check => Soldering-can copper protection preparation => Sample examination=> Casing => Examination => Storing=> Delivery.

Double-face panel process:
Material sending => Drilling => Removing burr => Copper sinking=> Electroforming copper=> Board milling=> Roundness transfer => Plating => Eroding board => Etch check => Blocking soldering=> Character => Computer mill/mould rushing => Short circuit test => Final check => Sample examination=> Casing => Examination => Storing=> Delivery.

Multi-face panel process:
Material sending => Lining making => Etch=> Press=> Drilling => Removing glue dregs=> Removing burr => Copper sinking => Electroforming copper=> Board milling=> Roundness transfer => Plating => Eroding board => Etch check => Blocking soldering => Character => Computer mill/mould rushing => Short circuit test => Final check => Sample examination=> Casing => Examination => Storing=> Delivery.